Bergquist Hi-Flow 300P导热绝缘相变化材料

材料生产商：美国贝格斯（BERGQUIST）公司研发产品

Hi-Flow 300P可供规格：

厚度： 0.102mm  0.11mm  0.127mm

片材： 279.4 mm*304.8 mm

卷材：  279.4mm*76.2 m

持续使用温度：150°

导热系数：1.6W/m-K

热阻： 0.13C-in2/W(25psi)

背胶： 单面带压敏胶/不带胶

颜色：绿色

Hi-Flow 300P应用材料特性：

Hi-Flow 300P已被市场认可了的聚酰亚胺基材，卓越的绝缘性能，卓越的抗切割性能

Hi-Flow® 300P consists of a thermally conductive 55°C phase change compound coated on a thermally conductive polyimide film.The polyimide reinforcement makes the material easy to handle and the 55°C phase change temperature minimizes shipping and handling problems.
Hi-Flow® 300P achieves superior values in voltage breakdown and thermal performance when compared to its competition.The product is supplied on an easy release liner for exceptional handling in high volume manual assemblies. Hi-Flow 300P is designed for use as a thermal interface material between electronic power devices requiring electrical isolation to the heat sink.
Bergquist suggests the use of spring clips to assure constant pressure with the interface and power source. Please refer to thermal performance data to determine nominal spring pressure for your application.

Hi-Flow 300P材料说明：

在CPU或功率元器件和散热器之间作为导热界面，Hi-Flow相变化材料是导热膏很好的替代物。材料在特定的相变化温度下从固态变成液态，可以来确保总的界面润湿，无溢出。与导热膏比较，它无脏污，污染和麻烦。

Hi-Flow 300P典型应用：

弹片/扣具安装

独立的功率半导体和模块

Hi-Flow 300P技术优势分析：

和其他品牌同类产品相比较，Hi-Flow 300P在击穿电压和导热性能上更胜一筹。该产品提供易撕离型纸，在大规模的人工装配中特别便利。

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